💾 Chip Tray Generator

Trays nest by a top rim and a matching bottom recess; heights may differ between trays, only the outer format must match. PGA packages rest on a central pedestal inside the pin-free centre, or on an edge ledge / hollow pedestal where the underside carries capacitors. QFP and PLCC chips rest on a pad under the body so the leads float, as in JEDEC shipping trays. DIP chips lie on a centre rail between the pin rows, like in a shipping tube. Memory modules stand upright in grooves in the end walls, like in the original module trays, on feet under the bare PCB ends or on a centre hump. Every pocket has a push-out hole so one chip can be lifted out of a full tray, and the nesting step can be chamfered so nothing needs support or left square if you would rather add support in the slicer. Dimensions come from the datasheets and JEDEC outlines listed per package.